本文使用奈米壓痕試驗機研究奈米刮削之溝槽幾何及刮削參數對矽相變化之影響。在奈米刮削之溝槽幾何方面，刮削刀具為Berkovich三角錐探針，刮削材料為矽晶片及具無晶鋁鍍膜矽晶片，研究主要觀察刮削後之溝槽幾何。實驗使用平面端及錐面端兩種不同刀具方向進行刮削，分別探討材料移除機制及效率。此外，在刮削具無晶鋁鍍膜矽晶片實驗中，並進一步分析探討力量與深度之關係。研究亦針對矽刮削加工後探討其相變化之情形，實驗中改變刮削速度及刮削之正向力，並藉由拉曼光譜檢視相變化產生之過程。實驗結果顯示刮削速度大時，矽之相變化均為由第一相轉為非晶相；而當刮削速度小時，矽之相變化則依力量變化為由第一相轉為第十二相或第三相。

In this investigation, the nano indentation is used to investigate the geometry of nano scratch grooves on amorphous aluminum film. The silicon phase transformations are also studied under different scratching conditions on the same machine. A Berkovich diamond indenter is used as a scriber in all the experiments. The material removal mechanisms and efficiency are discussed in two scratching orientation of the scriber, face-forward and edge-forward, on amorphous aluminum film and silicon. Furthermore, experiments are conducted to investigate relationship between the groove geometry and the scratching forces of amorphous aluminum film. In silicon scratching experiment, the phase transformations of the groove are observed by Raman spectroscopy under different scratching force and velocity. It is found that higher scratching velocity leads to amorphous phase transformation; on the other hand, lower scratching velocity favors the XII-Si or III-Si phase transformation depending on the magnitude of the the scratching force.

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