本研究運用真空化設備、高速影像擷取系統、溫控加熱模組、微機電振動等技術，建立系統化的球柵陣列（BGA）球狀焊材製程技術，並以均勻液滴噴射製程為主概念之錫球製程。本文使用壓電式震盪器產生均勻位移振動波並建立液滴成形環境真空化處理機制將熔融液體液滴化，配合內外壓差之穩定氣體射出均勻錫球，並可加高壓電將帶正電之錫球相互排斥而散開，發展連續單粒徑之錫球製程。
　　本文著重於(1)建立以均勻液滴噴射製程為主概念之錫球製程；(2)使用壓電式震盪器液滴化處理方法，以產生均勻位移振動波，配合內外壓差之穩定氣體射出均勻錫球；(3) 建立液滴成形環境真空化處理機制，並加高壓電將帶正電之錫球相互排斥而散開，以研製連續單粒徑之錫球製程；(4)錫球設備之實驗環境設定與建立。於實驗條件設定部分，經由適度調整震盪頻率、震盪桿與坩鍋圓型孔洞距離、輸入電壓及氣體吹出壓差值等參數，以下為其操作條件：震盪桿距離洞口2.0 mm、吹出壓力為0.35㎏/㎝2、震盪頻率2.2 kHz/振幅3~5μm、高壓電產生器3.2kV，可獲得最佳化之0.6 mm球徑的Sn-37wt%Pb含鉛錫球與Sn-3.0wt%Ag-0.5 wt%Cu無鉛錫球。
　　並將本實驗之錫球成品進行SEM觀察及EDS成份分析與粒徑品質檢驗，驗證本研究之可行性與實用性。未來的研究方向將朝著特殊錫球研製、系統架構改良及電腦化品質檢驗等三個方向進行。

　Based on the Uniform-Droplet Spray (UDS) concept, this study is to develop a systematically fabricated process of BGA solder ball with the integration of vacuuming equipment, high speed image capture system, temperature-control heating module and micro-machinery techniques. In an environment of little oxygen, liquid droplets are uniformly ejected from the small bottom hole of the heating crucible primarily by a piezoelectric vibrator. The droplets are dispersed by the repulsive forces, which are induced in a high electric field.
　From the experimental results, the optimum operation conditions can be obtained. To have solder balls of 0.6 mm in diameter for Sn-37wt %Pb and
Sn-3.0 wt%Ag-0.5wt%Cu alloy, the best working conditions are (1) the distance between the vibrating rod and the outlet hole of the crucible is 2.0 mm, (2) the inlet pressure of nitrogen is 0.35 kgf/cm2, (3) the frequency and the amplitude of the vibrator are 2.2 kHz and 3~5 m and (4) the output voltage of power supply is 3.2kV. The qualities of the finished products of solder ball are examined by SEM, EDS, roundness and pushing ball tests. From the examined results, it is verified that the fabricated process built in this paper is feasible and practical.
　The future work is recommended to stepwisely modify and improve each mechanism. The outcomes are expected to provide useful information to produce solder balls.

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