| 研究生: |
謝銘倫 Hsieh, Ming-Lun |
|---|---|
| 論文名稱: |
微細放電加工之加工參數影響研究 Effect Study of Working Parameters in Micro-EDM Process |
| 指導教授: |
李驊登
Lee, Hwa-Teng |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 機械工程學系 Department of Mechanical Engineering |
| 論文出版年: | 2008 |
| 畢業學年度: | 96 |
| 語文別: | 中文 |
| 論文頁數: | 73 |
| 中文關鍵詞: | 表層特性 、擴孔量 、碳化鎢 、微細放電加工 、破損層 、裂縫 |
| 外文關鍵詞: | Damage Layer, Cracks., Surface integrity, Hole enlargement, Tungsten carbide, Micro-EDM |
| 相關次數: | 點閱:190 下載:5 |
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碳化鎢具有高硬度、耐磨耗等特性,因而可用於製作微小元件,但也因此而難以使用傳統加工方法加工。放電加工法特別適用於高強度、高硬度材料之加工,而微細放電加工法適合於製作精微模具。因此,本研究以WEDG法與EDG法製作直徑為100μm微細電極,並利用微細放電加工機對KG5碳化鎢進行深寬比為10之盲孔加工。並藉由本實驗,探討不同放電加工參數(放電電壓、放電電流、放電持續時間、放電休止時間)對於碳化鎢之擴孔量、電極消耗、加工深度與表面缺陷之影響。
在微孔放電鑽孔加工中,由於電極對孔壁的放電與電極尖端消耗的關係,使得盲孔形狀趨於尖錐形。在本實驗中,當放電電流小於1.5A時可以藉由放電電壓的縮小以及放電休止時間的增加,有效的降低擴孔量的大小,但也容易造成電極消耗加劇、加工深度下降及因為加工時間過長造成孔底變形的情況。而當放電電流過大時會由於電極消耗劇烈,造成加工深度不足便結束加工,因此孔底的變形情況並不明顯。
碳化鎢的表面經微細放電後,其表面充滿了放電痕與放電加工表面的缺陷。在本實驗中,放電痕的大小受到放電電壓與放電電流的影響,且所有參數都會發現裂紋的存在。放電表面的裂紋大多沿著放電痕產生,在氣孔與空孔的附近尤其容易發現。氣孔與空孔延伸出來的裂紋,可利用降低Duty Factor的方式抑制空孔的產生,進而降低裂紋的發生。碳化鎢經微細放電後加工面會形成一層重鑄層,其厚度小於1μm,當放電能量大時才容易被發現之,且分佈相當不均勻。此外也會在孔壁的碳化鎢晶粒上發現因急熱遽冷影響而產生的熱裂紋。
Tungsten carbide (WC) is widely used in producing micro tools and components due to its high hardness and excellent resistance to wear, but it is also hard to machine by conventional ways. Micro-EDM is a process suitable for machining materials with high strength and toughness, and it is particularly useful to produce micro molds. Therefore, in this study, micro electrodes manufactured by EDG and WEDG are used to drill blind holes with aspect ratio of 10 on KG5 tungsten carbide. Effect of EDM parameters upon process characteristics and surface integrity, such as hole enlargement, electrode wear, hole machining depth, etc., are discussed.
During micro-EDM process, blind holes tend to cone-shape due to discharge machining at hole wall and extremely wearing at electrode tip. Decreasing pulse voltage and increasing pulse-off duration lead to decrease hole enlargement but increase both electrode wearing and process duration. A large pulse current causes extreme wearing of electrode and decrease the working depth, but the bottom of the blind hole is flat due to its short process time.
EDMed surface of WC is filled with discharge craters and surface defects. This study reveals that the size of discharge crater is affected by both pulse voltage and pulse current. On the working surface, cracks are found around discharge craters and porosities. Decreasing duty factor can reduce porosities and crack formation. The study also reveals the recast layer on working surface has been observed when discharge energy is large. The thickness of recast layer is smaller than 1μm. In addition, thermal cracks are observed in WC grains at hole wall.
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