本研究以矽晶圓做為基材製作矽基微結構模具，並將模具搭配高分子加工中廣為運用的微熱成型法，來製作高分子薄膜微結構，以用於微流體晶片系統。在加工模具製作方面，運用矽基加工技術 ( silicon-based micro-machining ) 中的誘導感應偶合電漿離子蝕刻 ( inductive coupled plasma-reactive ion etching，ICP-RIE )，製作不同深寬比的矽基微結構模具。本研究成功蝕刻出25種垂直且深寬比介於1.66 ~ 24.60的矽基微結構模具。同時，在深矽蝕刻製程中，當線寬大於50μm時，所出現的針草現象 ( black silicon method，BSM )，本研究亦提出消除針草的操作條件。
此外，為配合自製之微熱成型設備，本研究也製作線寬分別約為130與40μm的貫穿矽基微結構模具，並搭配厚度為40、70μm的polymethyl methacrylate ( PMMA ) 高分子薄膜進行微熱成型實驗，探討加工模具線寬、加工變數 ( 操作溫度、施加壓力、加壓時間 ) 對薄膜微結構成型的影響。利用微熱成型加工可製得深寬比介於0.44 ~ 2.53的高分子薄膜微結構。

In this study, we investigated the micro-thermoforming process for fabrication of polymeric thin film microstructures using silicon molds. The silicon molds with high aspect ratio microstructures (HARMs) were fabricated via inductive coupled plasma-reactive ion etching (ICP-RIE) process. The polymeric thin films with two different thicknesses were used and various processing conditions such as film temperature, applied pressure and thermoforming time were discussed. The result showed that the silicon molds with and without the through holes were constructed and the aspect ratio of the microstructures ranges from 1.7 to 24.6. For the molds without through holes, black silicon was formed at the bottom of the microstructures when the line width is larger than 50μm, which can be effectively removed by O2 plasma treatment. As to the thermoforming process, higher applied pressure, higher film temperature and longer thermoforming time will facilitate fabrication of polymeric thin film with microstructures; however, due to the limitation of the equipment/device, higher applied pressure, higher film temperature and longer thermoforming time may cause film broken at the locations where the film being clamped and pre-stretched during thermoforming process. Utilizing the thermoforming process, we were able to obtain the polymeric thin film with microstructures having aspect ratio ranging from 0.44 to 2.53. The mathematical equation describing the relationship between the depth and the film thickness of the thermoformed film for conventional thermoforming process was modified and a reasonably well agreement between calculation and experimental results was obtained.

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