薄膜電晶體訊號開關的功能被廣泛應用於平板顯示器，是面板產業中不可或缺的技術。導電高分子製做的有機薄膜電晶體因其可撓、可液相大面積製作的特點，成為新一代可撓曲平板顯示器的熱門驅動元件。然而，導電高分子軟質的特性，也使其分子排列形貌及相對應之電子結構缺陷多，電傳導效率不佳。為提升導電高分子的電性表現，需要製造長程有序的高分子結晶結構，方能提升載子傳導的效率。
本研究以聚（3-己烷噻吩）（P3HT）為薄膜電晶體半導體層材料，並系統性調控基板表面性質及製程溫度，以提升高分子的微觀排列有序性並提高電晶體量測之巨觀載子遷移率。
使高分子規整排列後，需藉由電晶體量測載子於電場中的傳遞效率，以驗證微觀排列與巨觀電性的相依性。有機電晶體的製作過程中，電極定義載子通道幾何形狀，是電晶體中不可或缺的結構；若根據半導體高分子能有序排列的距離定義、並製作電極，便能得到微觀電子結構效能的相關資訊，更精確聯繫微觀分子排列與電子結構效能。電極的製作仰賴微影製程，藉由對光阻曝光，再以顯影液溶解受曝圖形，便能蒸鍍金屬電極於基板，成功定義電晶體通道。為控制電晶體通道的幾何形狀，本研究自行架設自動化雷射曝光系統，以電腦繪圖定義曝光圖形；當通道形狀需要對應高分子有序區域改變時，便能有效率地即時改變電極的形狀及位置，並藉由電晶體量測電學傳導特性，連結微觀分子堆疊結構與巨觀載子傳導效率。
本研究以自動化雷射曝光系統蒸鍍電極以製作高分子薄膜電晶體，此系統的架設使本實驗室的電晶體製程更完整，並創造微影製程的可調控性，以應對有機電子元件與半導體高分子多變的製程，為實驗室的未來發展打下兼顧彈性與效率的基礎。

In this thesis, an automatic laser lithography system was successfully built, and organic thin film transistors (OTFTs) were fabricated via the system. By building a maskless, direct-laser-writing lithography system, we were able to adjust device geometry to match variable ordered region of organic thin films created through different processing conditions. After defining the device geometry, different self-assembled monolayers (SAM) was deposited, and then the poly(3-hexylthiophene) (P3HT) semiconducting layer was deposited under various temperature values to complete the fabrication of OTFTs. The measurements from atomic force microscopy, polarized Raman spectroscopy and transistor operations revealed that P3HT backbones demonstrated the highest order and performance at different deposition temperatures. Moreover, P3HT chains produced the best results in macroscopic morphology, microscopic order, and carrier mobility while the chain lengths of SAMs are compatible to that of the P3HT sidechains. Mismatch between the chain lengths of the SAMs and the side chain of P3HT inhibited proper interdigitation, making alignment difficult for P3HT. The device performance obtained by the self-built laser lithography system matched our previous works about the controls over intermolecular interactions; the higher order, the better performance. The harnessed intermolecular forces shed light on the future viability of soft electronics.

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