近年來，由於IC封裝技術朝向小尺寸、窄間距以及高密度發展。本文主要探討錫球間距對加強散熱型覆晶球柵陣列組合體之可靠度的影響，當構裝組合體經歷三個熱迴圈負載，溫度區間為-40oC～125oC。散熱強化型覆晶球柵陣列組合體是基本型覆晶球柵陣列封裝體包封著封膠，接著在封膠上面黏附著一片鋁質散熱板，最後以錫球構裝在印刷電路板上。
由於熱循環負載須需花費大量的時間與資源，將利用有限元素分析商用軟體Ansys進行模擬，本文使用Ansys模擬分析有鉛材料(63Sn37Pb)錫球與無鉛材料(96.5Sn3.5Ag)錫球於熱循環負載條件下。且所有的錫球為非線性黏塑材料，因此以亞蘭德模型來描述錫球的變化行為。
因此可定義出錫球在溫度循環負載過程中的塑性應變變化(plastic strain range)，並根據最大應變找出關鍵破壞錫球。同時，可發現關鍵錫球均位於下層的印刷電路板與上層基板界面接合處，且基板上方附有黏著一片鋁質散熱板的封膠，因接合處上方的封膠有轉折角度而導致應力集中。
錫球的可靠度可利用一般最常見的Coffin-Manson公式來作預測，接著使用Coffin-Manson公式來預測錫球的疲勞壽命與可靠度。結果顯示，當錫球間距縮小疲勞壽命會增加，而且無鉛材料錫球的可靠度會優於有鉛材料錫球。

In recent years, due to the IC assembly and packaging technology is developing to small size, fine pitch and high density. In this paper, the effect of solder-ball pitch on the reliability of the thermally enhanced FC-PBGA (Flip-Chip Plastic Ball Grid Array) assembly during Three thermal cycles with ranged -40oC to 125oC were investigated. As a result of the huge cost time and resource for thermal cyclic loading, the finite element analysis commercial software Ansys is used for simulation. then by using Ansys to simulate lead (63Sn37Pb) and lead-free (96.5Sn3.5Ag) solder balls under different pitch during three thermal cyclic loading. in this simulation, all the solder balls were modeled with nonlinear visco-plastic time and temperature dependent material properties based on Anand's model.

Thus, the relative plastic strain range of the solder ball during thermal cyclic loading can be determined. according to the maximum stress and strain find out the critical solder ball. simultaneously, the critical solder ball occurs at the interface between PCB and Substrate. Solder ball reliability is predicted by the widely accepted Coffin-Manson equation. then by using Coffin-Manson equation to predict the fatigue life and reliability of the solder ball. the results show that the solder ball pitch decrease, fatigue life increase. and the reliability is comparing favorably lead with lead-free solder balls.

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