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研究生：	溫從凱 Wen, Tsung-Kai
論文名稱：	利用G/L方法探討WLCSP構裝含UBM錫球之疲勞壽命 Investigation of the Fatigue Life of Solders with Under Bump Metallurgy for Wafer Level Chip Scale Package by G/L Method
指導教授：	陳榮盛 Chen, Rong-Sheng
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系 Department of Engineering Science
論文出版年：	2005
畢業學年度：	93
語文別：	中文
論文頁數：	117
中文關鍵詞：	晶圓級封裝、疲勞壽命、全域/局部方法、多層金屬薄膜
外文關鍵詞：	WLCSP, Fatigue Life, Global/Local Method, UBM
相關次數：	點閱：102 下載：2
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　　直接以晶片進行構裝之晶圓級封裝形式(Wafer Level Chip Scale Package, WLCSP)，由於其尺寸較小可提高產品之聚集度，不需使用機械鋼嘴打線或加壓加熱，可在晶圓廠中直接進行，已逐漸成為未來發展的趨勢。其中連結錫球與晶片二者間之多層金屬薄膜(Under Bump Metallurgy簡稱UBM)，對產品的好壞具有決定性之影響力。

　　本文採用96.5Sn3.5Ag無鉛錫球含UBM材料之WLCSP構裝體，先利用Surface Evolver預測錫球迴焊後之形狀，再利用ANSYS 7.0有限元素分析軟體建立三維模型，並將介於錫球與晶片間之多層金屬薄膜材料考慮於模型中。其間塑性部分採用多線性等向硬化( Multilinear isotropic hardening ) 及潛變部分採用葛拉佛拉-阿瑞尼阿斯潛變模式(Garofalo-Arrhenius creep model) 進行分析，在分析時引入全域/局部有限元素分析方法，以有效改善網格分割造成結果準確性及收斂性的問題。接著採用單一因子實驗方法來評估個別因子對錫球疲勞壽命的影響。

　　透過本文之完成，希望能提供業界對無鉛錫球及UBM材料之應用更深一層的了解，進而提升產品的競爭力。

　The Wafer Level Chip Scale Package (WLCSP) is a packaging technology starting from the wafer directly, may enhance compactness of the product due to its smaller size. It doesn’t need wire bonding or pressurizing/heating, and may proceed directly in the wafer factory, hence, is becoming a trend in the future gradually. Moreover, the multi-layered Under Bump Metallurgy (UBM) between the solder ball and the silicon chip has decisive impact on the quality of products.

　This paper adopted 96.5Sn3.5Ag lead-free solder ball containing UBM in a WLCSP. First, Surface Evolver was used to predict the shape of solder balls after reflow, then the finite element analysis software, ANSYS 7.0, is applied to set up a three-dimensional model based on the consideration of the multi-layered Under Bump Metallurgy (UBM). Multilinear isotropic hardening and Garofalo-Arrhenius creep model were used in the plastic and creep analysis respectively. The global/local finite element method was introduced to improve accuracy and convergence in meshing. Finally, the single factor experiment was adopted to predict the impact on the fatigue life of solder balls by each factor.

　Hoping the completion of this paper may offer helpful suggestions to manufacturers on the application of lead-free solder ball and UBM to improve the competitive edge of the products.

目   錄
中文摘要.......................................................................................I           
英文摘要.......................................................................................Ⅱ
誌謝...............................................................................................Ⅲ
目錄...............................................................................................Ⅳ
表目錄...........................................................................................Ⅶ
圖目錄......................................................................................... ⅩⅠ
符號說明......................................................................................ⅩⅢ
第一章　緒論.................................................................................1
1-1 前言.....................................................................................................1
1-2 研究動機與目的.................................................................................2
1-3 文獻回顧.............................................................................................4
1-4 研究方法.............................................................................................6
1-5 章節提要.............................................................................................7
第二章　理論基礎.........................................................................8
2-1 研究主題.............................................................................................8
2-2塑性理論基礎.....................................................................................10
2-2-1 塑性行為模式............................................................................10
2-2-2 硬化準則....................................................................................12
2-2-3 葛拉佛拉-阿瑞尼阿斯潛變模式...............................................15
2-3含UBM錫球之製程、應用及破壞情形........................................17
2-3-1含UBM錫球之製程與應用.................................................17
2-3-2含UBM錫球之破壞現象......................................................20
2-4 Surface Evolver介紹............................................................................21
2-4-1 Surface Evolver理論基礎............................................................21
2-5 Coffin-Manson疲勞壽命預測公式.....................................................24
第三章　分析模型之建立.................................................................34
3-1分析模型建立..................................................................................34
3-1-1 WLCSP模型之基本假設條件...................................................34
3-1-2 WLCSP構裝體模型...................................................................35
3-1-3 全域模型邊界條件與負載.........................................................37
3-1-4局部(Local) 模型及邊界條件....................................................38
3-2全域/局部模型有限元素分析.............................................................41
3-3分析流程............................................................................................44
3-4分析結果與評估..............................................................................45
3-4-1模擬分析結果...............................................................................45
3-4-2分析評估.......................................................................................48
第四章　利用全域/局部方法進行收斂性探討................................79
4-1全域/局部分析....................................................................................79
4-2全域/局部模型之收斂分析.................................................................80
4-2-1全域模型網格數目...................................................................80
4-2-2局部模型分析範圍.......................................................................81
第五章　分析方法及結果探討..........................................................98
5-1單一因子對疲勞壽命的影響...............................................................98
5-1-1單一因子水準值之選擇...............................................................98
5-1-2 96.5Sn3.5Ag無鉛錫球模型單一因子.......................................99
5-2 探討單一因子分析結果....................................................................101
第六章　結論..................................................................................109
6-1 結論...................................................................................................109
6-2 未來研究方向...................................................................................112
參考文獻........................................................................................113
自述................................................................................................117
                                    

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校內：2006-08-03公開
校外：2010-08-03公開

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