本文提出一套以劃切及裂片製程得到材料機械性質的方法，並分析製程應用於硬脆材料之加工特性。文中以不同劃切深度及刀刃後傾角進行實驗，觀察劃切痕跡之表面狀態。由劃切力量探討不同材料(包含：矽晶、光學玻璃、Cu2600及Al6061)的比切削能，再由裂片力量求出材料之機械性質如：楊氏係數、彎曲強度及破壞韌性。
　　另由實驗結果顯示切削深度由淺到深變化，加工材料將經歷延性、延脆轉換與脆性破壞三種移除機制。比切削能隨著切削深度由淺到深呈現下降之趨勢。最後分析結果得知對矽晶而言，切深大於1mm為脆性破壞，切深小於0.4mm為延性破壞；對STV-Glass而言切深大於2mm為脆性破壞，切深小於0.6mm為延性破壞。

　　This paper proposes a method which obtains mechanical properties of materials by scribing and breaking processes. This paper also analyzes the machining characteristics of brittle materials by these processes, and observed the scribing surface morphology by experimenting on different cutting traces and rake angles. The specific cutting energy of different materials such as silicon, optical glass, Cu2600 and Al6061 is discussed. Moreover, mechanical properties such as Young’s modulus, bending force and fracture toughness are calculated from breaking force.
　　The result of experiments shows that the cutting conditions will experience ductile, brittle–ductile transition and then brittle destruction when the cutting depth changes from shallow to deep. The deeper the cutting depth is, the less the specific cutting energy is. Finally, the process will be brittle or ductile process when the depth for silicon is more than 1mm or less than 0.4mm and it will be brittle or ductile process when the depth for STV-Glass is more than 2mm or less than 0.6mm.

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