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研究生: 鄭皓尹
Cheng, Hao-Yin
論文名稱: 晶片電感之端面銀漿研究
A study on the termination silver pastes for chip inductors
指導教授: 向性一
Hsiang, Hsing-I
學位類別: 碩士
Master
系所名稱: 工學院 - 資源工程學系
Department of Resources Engineering
論文出版年: 2013
畢業學年度: 101
語文別: 中文
論文頁數: 79
中文關鍵詞: 銀漿燒結界面反應有機載體黏度
外文關鍵詞: Silver pastes, Sintering, Interfacial reaction, Binder, Viscosity
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  • 本研究之目的在開發出具有良好移印能力及附著力之表面黏著型電感用端面電極銀漿。電感用端面電極銀漿主要的組成為銀粉、玻璃、有機載體三大成分,本文詳細探討不同玻璃組成(不同比例的硼含量與鉍含量)、不同的球狀與片狀銀粉比例及不同玻璃添加量對銀漿燒結緻密行為及顯微結構之影響,及對端面附著力及推力之影響。結果發現適當的調整玻璃組成中之硼(40wt%)、鉍(6.5wt%)含量、可降低銀漿的燒結緻密化溫度。添加適量之片狀銀粉具有導電架橋的功能,但是過量的添加將會導致玻璃於燒結時溢流到表面,使得孔隙增多,最佳的片球比約為4:6。此外,增加銀漿中玻璃含量的比例(15wt%),也可有效的增進緻密效果。有機載體部分,分子量越高之乙基纖維素可提高漿料流變性,但相對會提高漿料黏度,使移印不易進行。固含量是決定銀漿低轉速下的黏度指標,高轉速下主要是藉由乙基纖維素與溶劑改變黏度。

    The purpose of this study is to develop termination silver pastes which exhibit good printability and good adhesion.Termination silver pastes are composed of silver powder, glass powder, and organic vehicle. The effects of the amounts and chmical compositions of the glasses (different ratios of the boron content and bismuth content) , ratio of spherical and flake silver on the densification and microstructure of silver terminantion pastes.The results showed that the densification temperature could be reduced by adjusting the contents of boron and bismuth in the glass. Adding an appropriate amount of flaky silver powder can increase the bridging function, but adding excess will cause the glass to overflow to the surface during sintering, and hence result in the increase of pores. The optimal ratio of flaky and spherical silver powder is 4:6. Moreover, the densification increased with increasing the glass content in the silver paste. For the organic vehicle, the higher molecular weight of the ethyl cellulose can improve the thixotropy, but it will increase relative viscosity, which deteriorate the printability. The relative viscosity of the silver paste at low rotating speed was controlled by the solid content and the relative viscosity at high rotating speed was controlled by the viscosity of the vehicle.

    第一章 序論 1 1-1 前言 1 1-2 研究目的 3 第二章 前人研究及理論基礎 4 2-1電感端面銀漿材料.. 4 2-1-1銀漿材料-銀粉(Silver) 4 2-1-2銀漿材料-玻璃粉(Glass) 6 2-1-3銀漿材料-有機載體(Binder) 6 2-2液相燒結 10 2-2-1 接觸角 14 2-2-2 溶解度之影響 15 2-3 玻璃與鐵氧磁體之界面反應 17 2-3-1 物理毛細現象 17 2-3-2 界面反應現象 18 2-4流變性 20 2-4-1 牛頓流體與非牛頓流體簡介 20 2-4-2 流變學應用領域及方法 22 2-4-3 黏度單位及相關定義 23 第三章 實驗步驟與方法 27 3-1 實驗藥品 27 3-2 實驗流程 28 3-2-1玻璃粉的製備 28 3-2-2 銀粉-玻璃粉的製備 29 3-2-3 有機載體製備 30 3-2-4 銀漿混合後續製備 30 3-3 材料分析 31 3-3-1 粉末比表面積 31 3-3-2 顯微結構觀察 31 3-3-3 電子微探儀(EPMA)觀察 31 3-3-4 熱膨脹分析(DIL) 31 3-3-5 XRD結晶相鑑定 32 3-4銀漿後續分析 32 3-4-1,固含量測試 32 3-4-2 黏度測試 32 3-4-3耐銲錫性與推力測試 32 第四章 實驗結果與討論 33 4-1低溫用端面銀漿之玻璃系統 33 4-1-1 添加不同比例B2O3對銀-玻璃燒結之影響 33 4-1-2 低溫玻璃與鐵氧磁體之界面反應 35 4-1-3添加不同比例Bi2O3對玻璃與鐵氧磁體燒附之影響 40 4-2 玻璃對銀燒結之影響 44 4-2-1 玻璃對銀燒結緻密化曲線 44 4-2-2不同比例片狀、球狀銀粉對燒結之影響 47 4-2-3不同球狀銀粉對燒結之影響 49 4-2-4 玻璃添加量對銀漿燒結之影響 52 4-3 有機載體與漿料之流變行為 55 4-3-1不同比例之BCA/TERP溶劑對有機載體黏度之影響 55 4-3-2乙基纖維素對有機載體與漿料之影響 58 4-3-3固含量對漿料之影響 66 4-3-4 分散劑對漿料黏度之影響 74 第五章 結論 76 參考文獻 78

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