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研究生: 謝武聰
Hsieh, Wu-Tsung
論文名稱: U-Net類神經網路模型於電子元件模擬中預測二維物理量
U-Net Neural Network Model Predicting Two-Dimensional Physical Quantities for Electronic Device Simulations
指導教授: 高國興
Kao, Kuo-Hsing
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 奈米積體電路工程碩士博士學位學程
MS Degree/Ph.D. Program on Nano-Integrated-Circuit Engineering
論文出版年: 2022
畢業學年度: 110
語文別: 英文
論文頁數: 73
中文關鍵詞: 機械學習卷積神經網路U-Net雙閘極金屬氧化物半導體場笑電晶體TCAD
外文關鍵詞: Machine Learning, Convolutional Neural Network, U-Net, Double Gate Metal-Oxide-Semiconductor Field effect transistor (DG-MOSFET), TCAD
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  • 由於在資訊科技上應用的良好潛力,機械學習在近年來非常受歡迎。得益於半導體科技的進步,硬體設備的能力越來越好,不論是運算能力,或是資料的蒐集,都比以前更強。完善訓練後的神經網路搭配足夠的資料,能迅速並精確的得出結果,使得它能在各種領域上都能有傑出的發揮。
    以自我一致性求解基礎物理方程式的元件數值模擬在減少技術開發與時間的成本上非常有幫助。但不可避免的,元件微縮導致更加微妙的量子效應,以及其餘新的元件物理和參數,這促使了數值問題的產生,並要求有高昂的計算能力。
    此研究中我們選擇特定條件下進行數值模擬的一個二維元件,再將結果匯出,使用其中的一部分作為資料集訓練神經網路模型。當神經網路模型被訓練完畢後,便能更快速地計算出元件內部的物理量,並節省傳統的元件模擬所需的時間。
    我們也嘗試使用不同的資料集並研究模擬結果的準確度。一個是使用小的資料集訓練神經網路模型,去減少整體的元件模擬時間。另一個則是使用含有不同結構的元件的資料集訓練神經網路模型,並確認模型在面對各種設計的整體表現。

    Machine learning is very popular in recent years because of its great potential in the information technology applications. Thanks to the advancement of semiconductor technology, the capabilities of hardware become better. Not only computing power, but also data collection capabilities are stronger than before. With sufficient amount of data, well-trained neural network can predict fast and accurately which promises that it can perform well in many regimes.
    Device numerical simulation solving fundamental physics equation self-consistently can be very helpful to reduce technology development cost and time cost. However, it seems unavoidable that MOSFET scaling leads to more subtle quantum effects, other new device physics and parameters that need to be considered to design advanced devices with new materials. This may cause numerical problems and result in expensive computational power.
    We choose a two-dimensional device under specific conditions in the numerical simulations and extract the results that are used to be the dataset to train the neural network model. After neural network model is well-trained, it can calculate the physical quantities inside the device more quickly and save the time of traditional device simulations.
    We also try using other datasets to study the accuracy of the simulation outcome. One is a smaller amount of dataset to train the neural network model when reducing the total time of device simulations. Another is the dataset which including different structure of devices is used to train the neural network model and check the overall performance on which the model faces the various designs.

    摘要 I Abstract II 致謝 III Contents IV Table captions VII Figure captions VIII Chapter 1 Introduction and Motivation 1 1.1 MOSFET Scaling 1 1.2 TCAD Simulation 2 1.2.1 Device Simulation 2 1.2.2 Basic Model and Formula 2 1.3 Deep Learning 3 1.4 Motivation 4 1.5 Outline of the Thesis 4 Chapter 2 Double Gate-MOSFET Simulations Considering Quantum Mechanical Effects 5 2.1 Double Gate MOSFET 5 2.2 Physical Model Used in TCAD Simulations 6 2.2.1 Fermi Statistics 6 2.2.2 Bandgap narrowing model 6 2.2.3 Mobility Model 7 2.2.4 Shockley–Read–Hall Recombination 7 2.2.5 Quantum Confinement model 7 2.3 Data Extraction from TCAD Simulation 8 2.4 Input of the Neural Network Model 9 Chapter 3 Neural Network Architecture and Algorithm 11 3.1 Basic Algorithms 11 3.2 Convolutional Neural Network 15 3.3 Autoencoder, Fully Convolutional Network, and U-Net 17 3.4 Structure and Setting of U-Net Based Neural Network Model 19 3.5 Data Pre-Processing and Split 20 3.5.1 Data Pre- and Post-Processing 20 3.5.2 Data Split 21 Chapter 4 Result and Discussion 23 4.1 Behavior in DG-MOSFET with Different Conditions 25 4.1.1 Gate-Source voltage VGS 25 4.1.2 Ratio between Gate Length and Source/Drain Length 26 4.2 Electrostatic Potential Comparison between TCAD and NN 29 4.3 Carrier Density Comparison between TCAD and NN 30 4.4 Relative Error Rate Analysis of Electrostatic Potential and Carrier Density 31 4.5 Prediction of Electric Field using NN model 34 4.6 Prediction of DG-MOSFET with Different Geometric Structure 35 4.7 Result of Training with Small Dataset 39 4.8 Error Rate Comparison of Three Datasets 41 Chapter 5 Conclusion and Future Work 42 5.1 Conclusion 42 5.2 Future Work 43 References 44 Appendix I TCAD commands 46 I.1 Sentaurus Structure Editor (SDE) 46 I.2 Sentaurus Device (SDevice) 49 I.3 Sentaurus Visual (SVisual) Tcl command (Extract Data from TCAD Simulation for one Physical Quantity in a Device) 53 Appendix II Results of Three Testing Sets 55 II.1 Testing Set of Dataset no.1 55 II.2 Testing Set of Dataset no.2 56 II.3 Testing Set of Dataset no.3 66

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