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研究生： 陳彥廷
Chen, Yen-Ting
論文名稱： 奈米銀漿料的製備及性質研究
Preparation and Properties of Nano-silver Pastes
指導教授： 許聯崇
Hsu, Lien-Chung
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2016
畢業學年度： 104
語文別： 中文
論文頁數： 47
中文關鍵詞： 奈米銀漿料 、銅對銅接合 、低溫燒結
外文關鍵詞： Nano-silver pastes, copper-to-copper bonding, low temperature sintering
相關次數： 點閱：93  下載：7 
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    • 本研究成功合成被庚酸保護的奈米銀粒子，也合成出銀錯合物2-乙基己酸銀，並利用三滾筒式混料機混合奈米銀粒子、2-乙基己酸銀和二甲基乙醯胺，製備出一種三元銀漿料 — Paste PM03。透過改變2-乙基己酸銀添加比例和熱處理溫度並量測電阻率和剪切強度找出最適合應用的參數，也透過SEM觀察破斷面分析燒結後微結構和性質之間的關聯。最適當參數為添加17.5 wt% 2-乙基己酸銀的Paste PM03-17.5在250 oC熱壓30分鐘，電阻率為 (3.50±0.02)x10-7 Ω∙m，剪切強度為57.48 MPa。 300 oC熱壓雖然電阻率更低且剪切強度更高，但改善情況並不顯著。

    Silver 2-ethylhexanoate and silver nanoparticles were synthesized and used to prepare a nano-silver paste: paste PM03. We optimized the amount of silver 2-ethylhexanoate added and the heating temperature to obtain the best performance. The relationship between the microstructures and properties was studied. Less porosity was shown to lead to better resistivity and shear strength. Thermocompression of the paste PM03 at 250 oC with 10 MPa pressure for 30 minutes was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50±0.02)x10-7 Ω∙m, and the shear strength was 57.48 MPa. Thermocompression of the paste PM03 at 300 oC with 10 MPa pressure for 30 minutes resulted in lower resistivity and higher shear strength than thermocompression at 250 oC did, but the difference wasn’t obvious.

    摘要..................................................... III Extended Abstract....................................... III 致謝.................................................... XVI 目錄................................................... XVII 圖目錄................................................... XX 表目錄................................................. XXII 第一章 緒論.............................................. 1 1.1 前言.............................................. 1 1.2 研究動機.......................................... 1 第二章 文獻回顧與原理.................................... 3 2.1 金屬奈米粒子製備.................................. 3 2.1.1 保護基的作用與影響................................ 3 2.1.2 還原劑的作用與影響................................ 4 2.1.3 反應時間影響...................................... 5 2.2 奈米銀粒子應用.................................... 5 2.2.1 殺菌劑............................................ 5 2.2.2 奈米銀墨水及奈米銀漿料............................ 5 2.3 奈米粒子燒結機制.................................. 8 2.3.1 燒結機構與階段.................................... 8 2.3.2 奈米粒子燒結..................................... 10 2.4 3D封裝堆疊....................................... 11 第三章 實驗方法與步驟................................... 14 3.1 藥品與儀器....................................... 14 3.1.1 實驗藥品......................................... 14 3.1.2 實驗儀器......................................... 14 3.2 實驗步驟......................................... 16 3.2.1 奈米銀粒子合成................................... 16 3.2.2 2-乙基己酸銀合成................................. 17 3.2.3 奈米銀漿料製備................................... 17 3.2.4 電阻率試片製作及量測............................. 18 3.2.5 熱壓及剪切強度測試............................... 18 3.3 儀器分析原理與方法............................... 20 3.3.1 場發射掃描式電子顯微鏡........................... 20 3.3.2 功能性穿透式電子顯微鏡........................... 20 3.3.3 X光繞射分析儀.................................... 21 3.3.4 熱重分析儀....................................... 21 3.3.5 傅立葉轉換紅外光譜儀............................. 22 3.3.6 四點探針薄膜量測儀............................... 22 第四章 結果與討論....................................... 23 4.1 奈米銀粒子製備及性質之研究....................... 23 4.1.1 奈米銀粒子製備................................... 23 4.1.2 奈米銀粒子性質鑑定............................... 23 4.2 2-乙基己酸銀製備及性質研究....................... 26 4.2.1 2-乙基己酸銀製備................................. 26 4.2.2 2-乙基己酸銀性質鑑定............................. 27 4.3 奈米銀漿料製備................................... 30 4.4 2-乙基己酸銀對奈米銀漿料性質影響之研究........... 30 4.4.1 2-乙基己酸銀添加比例對奈米銀漿料電性之影響....... 30 4.4.2 2-乙基己酸銀添加比例對銅銅對接強度之影響......... 32 4.4.3 2-乙基己酸銀添加比例對奈米銀漿料燒結結構之影響... 33 4.5 熱處理溫度對奈米銀漿料性質影響之研究............. 36 4.5.1 熱處理溫度對奈米銀漿料電性之影響................. 36 4.5.2 熱處理溫度對銅銅對接強度之影響................... 37 4.5.3 熱處理溫度對奈米銀漿料燒結結構之影響............. 38 第五章 結論............................................. 41 參考文獻................................................. 42

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