半導體產品種類多、變異性大，造成以代工為主的封裝業面臨少量多樣的快速反應生產模式，因此其完工時間必須有效縮短，客戶滿意度也必須進一步提升，以符合市場要求。銲線區多為半導體封裝廠的瓶頸工作站，其加工時間長、機台數量多，若是排程或派工決策不良，將導致系統資源浪費，並造成系統流程阻塞，進而影響其他相關工作站，因此在不同產品投料量及有效分配資源的前提下，現場管理者必須即時的分配資源以應付產品快速轉換的需求，以達到即時性的排程與派工規劃。本研究提出結合基因演算法與離散事件模擬求解平行機台支派工問題，並以一封裝廠實際案例來驗證此方法的適用性，以作為實際工廠訂定決策的參考依據。

As there are varieties of semiconductor products, and they have a large variation on the specifications, the subcontractors whose major business is packing face a production mode of fast reaction to meet the request of diversification and small quantity. They must work very efficiently so that shorten their finish period, and also increase customer’s service level further in order to meet the market demand. In most cases, wire bonding is a bottleneck workstation for the semiconductor packing plants. The process time is so long, and the process requires many machines. Improper scheduling or dispatch might result in a waste on system resource, and a jam on the system flow, and then affects the relevant workstations. Therefore, under a premise of different input for each product and for efficient resource allocation, an administrator must to assign the resource immediately in order to meet the demand of fast change on the products, and to achieve the scheme of prompt scheduling and dispatching. This research is to suggest a model that combine genetic algorithm with discrete-event simulation in solving a real-time dispatching planning problem of parallel machines workstation . Eventually use a packing plant as the actual case to prove the practicability of the method. The plants may refer to this method to make their policy decision.

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