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研究生: 胡國祥
Hu, Guo-Shiang
論文名稱: Si/Al/Si三明治結構薄膜經退火後產生金屬誘發效果對結晶性、載子遷移率與導電性之影響
Effect of the Sandwich Designs of the Si/Al/Si Film in the Specimens on Metal-induced Si Crystallization Efficiency,Carrier Mobility and Electrical Conductivity after Annealing
指導教授: 林仁輝
Lin, Jen-Fin
學位類別: 碩士
Master
系所名稱: 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年: 2013
畢業學年度: 101
語文別: 中文
論文頁數: 127
中文關鍵詞: 金屬誘發低溫退火晶粒大小載子遷移率應力梯度
外文關鍵詞: Metal-induced, low-temperature annealing, grain size, carrier mobility, stress gradients
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  • 本研究使用快速熱退火製程讓奈米鋁金屬誘發矽結晶,共準備15個試片,試件結構為a-Si/Al/a-Si/SiO2/Glass,設計不同厚度的a-Si/Al/a-Si三明治結構可以增加鋁元素往兩邊矽層擴散的效率,導致載子遷移率提高。熱退火後影響鋁誘發矽結晶百分比的參數包括:改變試片頂層矽、中間層鋁、底層矽厚度與退火溫度。薄膜內鋁的擴散情形也是探討重點,其中鋁元素向左右兩邊矽層的擴散情形,隨著最大壓應力變化 ( )增加而鋁擴散深度增加。定義新參數PC,PC值為用來判斷薄膜內矽結晶品質好壞,其值為矽結晶百分比與矽平均晶粒大小的乘積(Product, PC),PC值隨著退火後應力變化( )增加而提高,且對於有孔洞的試片而言載子遷移率與退火後應力變化兩者呈線性關係。若要避免薄膜產生孔洞,則薄膜含鋁百分比( )增加時,退火後應力變化( )也要跟著提高。產生孔洞的兩個必要條件為退火溫度足夠高及薄膜含鋁百分比( )足夠大。當薄膜具有孔洞時,增加退火後應力變化( )可以降低薄單位面積孔隙率膜孔隙率(R*),單位面積孔隙率下降可導致載子遷移率提高。合適的三明治結構設計能在低溫(400℃)製程下製作多晶矽薄膜,並可應用於薄膜太陽能電池或主動矩陣發光二極體。

    In the present study, 15 kinds of the a-Si/Al/a-Si/SiO2/Glass specimen were prepared in order to investigate the Al-induced Si crystallizations after applying annealing. The composite film of a-Si/Al/a-Si is arranged in the sandwich form in order to improve the efficiency of Al diffusions into its two adjacent Si layers, and thus resulting in the increase in the specimen’s carrier mobility. Si crystallizations were carried out at the conditions including the changes in the thicknesses of the top and bottom Si layer and the middle Al film, and the annealing temperature. Al diffusion depths on its two sides is increased with increasing the max compressive stress change in the diffusion direction. The degree of Si crystallizations in terms of the product (PC) of the Si crystalline fraction and the mean grain size. The PC value is elevated by increasing the ( ), and specimen’s carrier mobility is linearly increased by increasing ( ). In the specimens without nanovoids, the ( ) value is presented to be increased proportional to . A sufficiently high annealing temperature in combination with sufficiently large become the prerequisite conditions of nanovoids created in the composite film. The increases in the ( ) leads to the reduction of R* value, thus resulting in the elevation of specimen’s carrier mobility. Appropriate thickness designs for the sandwich structure can achieve high Si crystallizations even operating the annealing process as low as 400 °C. High-quality poly-Si is an essential material for high-efficiency thin-film solar cells or AMOLED.

    摘要 I Abstract II 誌謝 IV 目錄 V 表目錄 VIII 圖目錄 IX 第一章 緒論 1 1-1 研究背景 1 1-2 研究動機 2 1-3 文獻回顧 5 1-3-1 直接沉積多晶法 6 1-3-2 固相結晶法 7 1-3-3 準分子雷射退火 8 1-3-4 金屬誘發結晶法 8 1-3-5 鋁金屬誘發結晶法 10 1-4 研究目的 13 第二章 薄膜應力的理論分析 18 2-1殘留應力簡介 18 2-2殘留應力理論分析 19 2-3退火過程中應力理論分析方法 22 2-4應力梯度理論分析 27 第三章 製程規劃及薄膜分析技術 35 3-1 製程設備與工作原理 35 3-1-1 超高真空離子束濺鍍原理 35 3-1-2 薄膜熱製程反應機制 38 3-2 薄膜檢測分析技術 39 3-2-1表面粗度儀 (α-Step)霍爾量測 (Hall measurement) 39 3-2-2掃描式電子顯微鏡 (SEM) 40 3-2-3聚焦離子束與電子束顯微系統 (DB-FIB) 41 3-2-4穿透式電子顯微鏡 (TEM) 42 3-2-5化學分析電子光譜儀 (ESCA) 44 3-2-6拉曼光譜分析 (Raman spectroscopy) 45 3-2-7分光光譜儀 (Spectrophotometer) 47 3-2-8低掠角X-ray光譜儀 (GIXRD) 48 3-2-9霍爾量測 (Hall measurement) 49 3-3 實驗流程與規劃 51 3-3-1 試片製作流程與分析 51 3-3-2 實驗參數規畫 53 第四章 結果與討論 67 4-1矽/鋁/矽三明治結構之實驗分析 67 4-2 薄膜表面形貌與孔洞 68 4-3矽/鋁/矽三明治結構之鋁元素擴散 69 4-3-1薄膜之縱深元素成分 69 4-3-2薄膜之縱深應力分布 71 4-4薄膜結晶性 72 4-5薄膜殘留應力 75 4-6載子遷移率與導電率 76 第五章 結論與未來展望 119 5-1 結論 119 5-2 未來展望 121 參考文獻 123

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