鋁基的金屬基複合材料由於在重量上具有優勢，為近年來相當熱門之熱管理材料。本研究以無電鍍銅技術製作鍍銅鋁粉並混合純銅粉，利用粉末冶金方式製作五種等不同含量之Cu/Al複合材料。此外為了瞭解無電鍍處理對複合材料的影響，以純銅/鋁粉依相同比例製成Cu/Al複合材料，與前者加以比較。製程上是使用熱壓與spark plasma sintering(SPS)。研究中對無電鍍銅前處理/無電鍍銅的參數進行最佳化的探討，並成功製備出鍍層均勻、粒徑65~75μm、銅含量為12.5vol% 之鍍銅鋁粉。
以熱壓法製作銅鋁複合材料，發現當溫度超過400℃，即會產生CuAl2、Cu9Al4等介金屬化合物。若改以SPS製程製作，在400℃、100MPa的參數下，可以得到幾乎不具介金屬化合物結構，緻密度均在98%以上之複合材料。隨著銅含量的增加，其微硬度、壓縮降伏強度、熱傳導係數均隨著提升，緻密度與熱膨脹係數略有減少。最後發現經過無電鍍銅表面處理後，的確有助於提高複合材料之熱性質與機械性質。

Aluminum base-metal matrix composite became more popular in thermo management materials over the past few years，because it had the advantage of weight. In this research，we prepared the aluminum powder with copper coated via electrolessplating technique. Cu/Al composites of five different contents will be fabricated by P/M method. Besides to realize the effects of electrolessplating in composites，we used pure Cu and Al powders to make the former composites in the same Cu/Al ratio .Hot press and spark plasma sintering (SPS) were both applied to make the composites. The best parameters of pre-copper elelctrolessplating and copper elelctrolessplating were discussed in this research，and the aluminum powders with fine copper coated，65~75μm in diameter，12.5Cu vol%，were successfully made.
The composites would have the several IMC structures like CuAl2、Cu9Al4 ，when temperature over 400℃ by hot pressing process. But them made by SPS process in 400℃/100MPa had invisible IMC structures，and the density of theoretical were over 98%. With the increase of copper content，the thermal conductivity，micro-hardness and compression yield strength would get raise，and the density of theoretical，coefficient of thermal expansion would be a little decreased. Finally，it would be helping of increasing the thermal and mechanical properties of the composites via the method of elelctrolessplating on surface of the powders .

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