本文主旨利用半導體微型壓阻感測器進行材料衝擊測試的相關研究，搭配週邊的各項機械、電路元件後，將可組成一完整的動態衝壓測試系統。
　　半導體微型壓阻感測器安裝於一環形懸臂樑根部，搭配商用應變計及加速規的校正後，可得微型壓阻感測器的靈敏度為11.96；另外經實驗與理論證明後，可知微型壓阻感測器的應變訊號，將與懸臂樑自由端的加速度訊號呈線性關係。
　　由微型壓阻感測器所組成的衝擊系統，經多次高G值衝擊實驗後，證明其具有不錯的訊號反應能力，同時藉由商用有限元素軟體LS-DYNA 3D的輔助，可使我們更加了解試材料在衝擊瞬間的機械動態反應，如此將可與實驗結果進行相關的驗證。

　　The purpose of this thesis is to study the dynamic response of semiconductor micro strain gage. Semiconductor micro strain gage, mechanical components, and electronics can be applied to establish an impact test system. Besides, digital signal sampling card is added to acquire real time reflection of micro sensor. It will help us to analyze the condition of micro sensor during the period of impact.
　　Micro strain gage are fixed on the root edge of ring-type cantilever beam. After adjusting by commercial strain gage and accelerometer, the sensitivity 11.96 of micro strain gage will be found. From the resolutions of experiment and theory, we also proof the linear relationship between the tip acceleration and the root strain of cantilever beam.
　　After many times of impact experiments, we found out micro strain gage still has function in High G environment. Furthermore, commercial numerical analysis software “LS-DYNA” will assist us in simulating the transient behavior of impact. Finally, an effective material test environment will be created.

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