| 研究生: |
黃振訓 Wong, Zhen-Xun |
|---|---|
| 論文名稱: |
多層石墨烯層間附著錫/二氧化錫之合成與性質研究 Synthesis and Properties of Multilayer Graphene Coated with Sn/SnO2 |
| 指導教授: |
林光隆
Lin, Kwang-Lung |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2017 |
| 畢業學年度: | 105 |
| 語文別: | 中文 |
| 論文頁數: | 95 |
| 中文關鍵詞: | 石墨烯 、氧化石墨烯 、熱界面材料 |
| 外文關鍵詞: | multilayer graphene, graphene oxide, thermal conductivity |
| 相關次數: | 點閱:97 下載:2 |
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本實驗係對多層石墨烯表面進行官能基化(Functionalization)處理,並於表面鍍著氧化錫後,予以還原處理以製備石墨烯/錫複合材料。本實驗合成石墨烯/錫複合材料之過程,首先將市售之多層石墨烯在氧環境下進行熱處理,使得石墨烯表面引入官能基團,即氧化石墨烯。繼以溶液共混方式以SnCl2和HCl在氧化石墨烯表面鍵結SnO2以形成石墨烯/二氧化錫。後續以兩種方法還原石墨烯/二氧化錫,第一種方法只利用95%N2/5%H2混合氣體;第二種方法利用甲烷 (CH4) ,有效將二氧化錫還原成錫。此外,為了得到更多的純錫本研究嘗試利用單步驟還原法,即置於高溫927oC甲烷(CH4)環境下持溫2小時,以及雙步驟還原法,即利用95%N2/5%H2混合氣體於200oC持溫5小時後,繼續利用甲烷(CH4)於高溫927oC持溫2小時實驗證實雙步驟還原法比單步驟還原效果佳。考慮現今電子產品對導熱和散熱的需求,本研究進一步將原始石墨烯粉末與石墨烯/錫粉末壓錠並燒結,製備成複合錠材進行熱傳導率的量測;量測結果顯示,因石墨烯/錫無法達到預期之緻密性與均勻性,原始石墨烯不論平行方向或垂直方向熱傳導都優於石墨烯/錫,同時也低於預測之熱傳導值。
This study tried to prepare the composite material structure consisting of Sn particles and multilayer graphene nanosheets. The pristine multilayer graphene surface was firstly functionalized by heat treatment under oxygen environment to produce graphene oxide, followed by blending with SnCl2 and HCl chemical solution to allow graphene oxide surface bonded with SnO2 to form graphene/tin oxide. The reduction of the tin oxide was conducted with two different graphene/tin dioxide reduction methods using 95% N2 / 5% H2 forming gas or methane (CH4) as reducing agent. The results showed that CH4 effectively reduced SnO2 to Sn compared with 95% N2 / 5% H2 forming gas. This study also applied single-step reduction method under 927 oC methane environment for 2 hours and two-step reduction method under 200 oC 95% N2 / 5% H2 forming gas for 5 hours, followed by reduction under 927 oC methane environment for 2 hours, The experiment confirmed that the two-step reduction method was better than the single-step reduction. Considering the current demand for thermal and heat dissipation of electronic equipment, the pristine graphene powder and graphene/tin powder were further made into pellet separately for heat conductivity measurement. The results showed that the heat conductivity of pristine graphene and Graphene/Sn pellet, either parallel or vertical direction, has thermal conductivity lower than the predicted value for the reason of not achieving the expected density and uniformity.
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