在半導體產業中，維修保養這部分尤為重要，他關係到製程是否能依照需求正常執行，以及晶圓的表面加工精密程度是否有達到標準，有了以上的這些，才能確保在每次的產出後 ， 都能保有其相當水準的良率 ， 而保養維修的成本支出是一筆可觀的費用 ， 小則數千 ， 動則上萬 ，因此會對該部件進行評估 ， 盡可能地達到其壽命 ， 若是因意外或是人為疏失造成損壞 ， 那必定是得做更換 ， 考慮到成本問題 ， 還在開發中的製程機台結構設計便與後續的維護保養次數與妥善率相關聯 ， 當然製程上對於需求的參數調整 ， 這也是相當中要的一環 ， 本研究室以設備結構上改善為出發點去做研究 ， 因此製程上相關聯的部分較少提及 ；一個好的結構設計能夠為後續帶來龐大的收益 ， 例如 : 良好的產品妥善率 ，製程參數的調校效率 ，後續維護保養的成本支出較其他機台少 …等 ， 除此之外，也能從舊有機台上做結構修整以達到製程需求與保養成本支出減少。
本研究以化學氣相沉積的設備結構上做修整，調整的參數由進氣口的結構開始，在進氣結中增加倒流條，接著調整出氣口的石英孔距，後續是減少進氣結構的整體體積，最後由以上的三點合併到同一模擬中，藉此觀察內部的流場改善是否能因共同加入這些條件而能降低絮流造成內部結構易形成髒污的機率。
關鍵字:設備結構、化學氣相沉積、流場改善。

In this study, the structure of the chemical vapor deposition chamber is modified numerically. The adjusted parameters were the structure of the air inlet by adding a flow bar in the air inlet junction, increasing the release hole, reducing the volume of the intake structure, and increasing the diameter of release hole. Their effects were numerically evaluated to check whether the improvement of the internal flow field can reduce the flow recirculation which easily leads structures being dirty. Thus, the frequency of maintenance can be reduced.

Keywords: air inlet, chemical vapor deposition, flow field improvement.

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