Sn-Zn銲錫合金不含介金屬化合物，電導率表現優良且成本低，可適合應用於光伏模組之電子傳導。本實驗選取含Sn-30Zn、Sn-50Zn及Sn-70Zn銲錫鍍層之光伏導帶為實驗材料進行研究。有別於現今商用銅導帶，本實驗選用商用純鋁導帶，其亦具有良好導電性且成本便宜。實驗利用界面微觀組織特徵與剝離力測試評估Sn-xZn/ Al光伏模組之製程條件，並以高電流通電模擬電子作用下的微觀組織及體電阻變化，以評估工業應用性。
　　實驗結果顯示光伏鋁帶微觀組織中，Sn-Zn/ Al之接合並不會產生介金屬化合物，其接合機制是利用液相Zn由Al晶界穿隧至Al基材。光伏鋁帶與銀膠回銲後，Al/solder界面組織無太大變化；而在solder/Ag會形成AgZn3。隨著回銲時間增加，Sn-30Zn及Sn-50Zn模組之AgZn3厚度變厚，而Sn-70Zn無此趨勢，原因是回銲條件下無法產生足夠液相，而殘餘銀膠原厚度皆有隨回銲時間增加而減少之趨勢。此外，本實驗選取最高剝離力之Sn-50Zn模組作為後續通電之試驗，經由72 hr兩種通電方向結果顯示，體電阻與AgZn3厚度皆增加，而由鋁方向通電模組之體電阻表現較銀方向通電模組佳，原因為銀方向通電模組在銲錫基地存在AgZn3，將提高電子傳遞路徑也縮小通電截面積。與前人研究之SAC305/ Cu光伏模組及Sn-xZn/ Cu光伏模組比較發現，初期Sn-50Zn/ Al光伏模組體電阻與其他系統相當，但是在相對較長之通電時間後，體電阻增加的幅度較少，可確定Sn-50Zn/ Al光伏模組在電流作用下具較佳穩定性。

The interfacial microstructures, peeling force, and series resistance of photovoltaic (PV) Aluminum ribbon containing Sn-30Zn, Sn-50Zn and Sn-70Zn are investigated. After dipping, the bonding mechanism of PV ribbon was found by the solder liquid phase penetration along Al. grain boundary. After reflow, the AgZn3 formed at the solder/Ag interface which thickness would increase as reflowing time increase. After current injection, the Ag film consumed and the thickness of AgZn3 showed significantly increased. Volume resistance of both Al direction and Ag direction modules increased, however, the volume resistance of Ag direction module slightly higher than Al direction module due to AgZn3 formed in the solder matrix which caused the increasing of electron path and reducing the cross section area. After thermal aging, the results showed that at 80 oC the module was still stable. In the contrast with copper ribbon system, Sn-50Zn Aluminum ribbon system revealed more stable ability under electrical current operation.

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