在IC封裝的製程當中為了要得到良好的製程結果並避免嚴重的金線問題發生，大多是藉由田口方法或是經驗良好的工程師經由不斷地反覆的實驗找出良好的製程參數，但此方法隨著產品輕薄化的發展趨勢而逐漸受到考驗，本文提出了一套使用模流分析軟體搭配類神經網路及遺傳演算法的方法來找出製程中最佳的製程參數，以避免嚴重的金線偏移問題發生。首先先選出製程中可能影響實驗結果的數個製程參數，接下來藉由模流分析軟體分析出製程中影響力較大的製程參數，並以這些參數作為類神經網路的輸入項及使用模流分析軟體的模擬結果來訓練類神經網路，找出輸入項與輸出項也就是金線偏移結果之間的非線性關係，接下來使用遺傳演算法計算非線性關係中的最佳結果也就是最佳製程參數。此方法的優勢在於可以大幅的縮減所需的實驗次數，並藉由模流分析軟體搭配類神經網路及遺傳演算法迅速的得出製程中最佳的參數設計以避免嚴重的金線問題發生。本文使用BGA(Ball Grid Array)模型作為例子並以Moldex3D驗證最佳化效果，其研究結果在最大金線偏移有明顯的改善。

In electronic packaging, molding encapsulates a package to protect the integrated circuit chips and wires from environmental or mechanical damages. During molding, defects like wire sweep may occur. Gold wires are common components in integrated circuit IC packages to transfer electronic signals between the die and the lead-frame contacts. Number-increased I/Os are built with more wires and smaller wire gaps increasing wire sweep problems. Earlier, experienced engineers solved these problems through trial and error requiring a large number of molding experiments. In this study, a process optimization approach with CAE tools, neural network, and genetic algorithm is proposed for preventing serious wire sweep. The approach determines the optimal process parameter settings for transfer molding electronic packages. The proposed method eliminates the need to perform a large number of experiments, and even improves the experimental parameter settings if those experiments were performed.

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