本論文整合近場靜電紡絲技術(Near-field Electrospinning, NFES)，搭配積層製造技術(Additive Manufacturing, AM)建構三維直立式靜電紡絲結構，改善本實驗室先前開發的金字塔堆疊技術、製程參數以及溶液成分，並以調控製程參數為依據來開發三維直立式結構之堆疊技術。透過近場直寫式靜電紡絲製程參數以分析纖維直徑，並探討溶液組成對堆疊技術的影響。由量測實驗驗證，本論文開發之3D直立式靜電紡絲技術可成功堆疊十層以上之細微結構，在相同壓力下，直立式堆疊結構較前期金字塔堆疊結構可提升約1.3倍的電壓且靈敏度提升約2.6倍，證實直立式堆疊結構可產生較大的電壓與靈敏度。此外，將不同層數的直立式結構進行電壓測試，可以觀察到隨著層數增加，其電壓也會線性增加，未來可拓展於壓電式機電系統的應用與製造。

This paper integrates Near-field Electrospinning(NFES) technology with Additive Manufacturing(AM) process to fabricate 3D microstructure to improve the stacking method and process parameters of the previous process in our laboratory. As well as the composition of the solution , the stacking technology of the three-dimensional vertical structure is developed based on the control process parameters. This paper uses Scanning Electron Microscope (SEM) to observe the fiber stacking results. It can verify the feasibility of the upright fiber structure and successfully stack up to a ten-layer structure. It also confirms that the fibers can be stacked by the process parameters of this paper to produce a 3D fiber vertical microstructure with a certain height. To study the effect of the same layer structure on the “wall” stack structure of this paper and the “Pyramid” stack structure of the previous process, the improvement of the structure increases the voltage by about 1.3 times to verify that the optimized fiber structure can generate a larger voltage. And the voltage test of the fiber structure with different number of layers, it can be observed that as the number of layers increases, the voltage that can be generated will also increase. In the future, it can be expected to increase the number of fiber layers to increase the voltage that can be generated by the fiber structure and develop it to expand the application and manufacturing of piezoelectric microelectromechanical systems (MEMS).

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