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研究生: 胡舒凱
Hu, Su-Kai
論文名稱: 討論利用雷射剝離法製作的發光二極體之漏電流與特性
Leakage Current and Performance of Laser Lift-off LED Devices
指導教授: 蘇炎坤
Su, Yen-Kun
學位類別: 碩士
Master
系所名稱: 工學院 - 微機電系統工程研究所
Institute of Micro-Electro-Mechancial-System Engineering
論文出版年: 2006
畢業學年度: 94
語文別: 英文
論文頁數: 69
中文關鍵詞: 發光二極體雷射剝離
外文關鍵詞: copper substrate, LED, laser lift-off, electroplating, GaN
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  • 利用雷射剝離法所製作的氮化鎵發光二極體已經被研究了七、八年,但是在發光強度及發光效率上一直沒有重大的突破。為了找出原因及製作高亮度的發光二極體,故作此研究。
    實驗中發現,垂直式結構由於氮化鎵的磊晶層先天上缺陷,及經過雷射剝離法後所造成的應力釋放,會導致有很大的漏電流產生。另外,使用感應耦合電漿蝕刻也很容易造成側壁漏電流的產生。雖然很大的漏電流的產生會造成元件發光強度及發光效率的下降,但是由於發光面積比傳統製程來得大,故垂直式結構的發光二極體的發光強度比傳統發光二極體也來得強。
    不只是亮度上有所提升,還有垂直式的發光二極體的波長漂移現象對注入電流的影響,遠比傳統式的發光二極體來得小很多。最後還有透過接觸溫度的量測,可以得知垂直式的發光二極體的接觸溫度相對來說也是比較低的。
    雖然有很好的導熱性,但是應用於封裝體上,熱能一直累積在封裝體內進而影響元件的壽命時間。

    The fabrication of the laser lift-off (LLO) GaN LED has investigated for 7~8 years, but there is no important breakthrough in light intensity and efficiency. In order to find out this reason and fabricate high brightness LED, this thesis is written.
    Due to the natural dislocations in the GaN epilayers and released stress after LLO process, the strong leakage current occurs. Besides, the ICP process would also cause the leakage current of sidewall. Although the leakage current would make the light intensity and efficiency of the LEDs decay, the light intensity of vertical LLO LED is brighter than that of traditional LEDs because the area of light is larger.
    There is not only the increase of light intensity but also the smaller red-shift effect compared the p-side-down and p-side-up LEDs with traditional LED. Finally, we could obtain that the junction temperature of p-side-down LED is relatively low during the junction temperature measurement.
    There is good thermal conductivity in the LLO LED, but the thermal energy accumulate in the package. Therefore, it decreases the reliability of the LLO LED.

    ABSTRACT IN CHINESE VI ABSTRACT VII ACKNOWLEDGMENTS VIII CONTENTS IX CHAPTER Ⅰ INTRODUCTION - 1 - 1.1 THE DEVELOPMENT OF HIGH BRIGHTNESS GAN BASED LEDS - 1 - 1.2 THE BACKGROUND OF LASER LIFT-OFF TECHNOLOGY - 2 - CHAPTER Ⅱ FABRICATION AND METHODS - 5 - 2.1 FABRICATION OF VERTICAL P-SIDE-DOWN LED - 5 - 2.1.1 P-type Ohmic Contact - 7 - 2.1.2 Electroplating Copper Substrate - 10 - 2.1.3 Laser Lift-off (LLO) Process - 11 - 2.2 FABRICATION OF VERTICAL P-SIDE-UP LED - 13 - 2.2.1 Laser Semi-Cutting - 15 - CHAPTER Ⅲ RESULTS AND DISCUSSION - 31 - 3.1 COMPARISON OF PL SPECTRUM AND EL SPECTRUM BEFORE AND AFTER LASER LIFT-OFF - 31 - 3.2 LEAKAGE CURRENT MECHANISM - 32 - 3.3 C-AFM MEASUREMENT OF P-SIDE-DOWN STRUCTURE AND TRADITIONAL STRUCTURE - 34 - 3.4 LEAKAGE CURRENT IN P-SIDE-DOWN LED AND IMPROVEMENT METHOD - 35 - 3.5 OPTICAL AND ELECTRICAL CHARACTERISTICS OF P-SIDE-DOWN LED, P-SIDE-UP LED, AND TRADITIONAL LED - 37 - 3.6 JUNCTION TEMPERATURES OF TRADITIONAL LED AND P-SIDE-DOWN LED - 40 - 3.7 LIFE TIME TEST. - 42 - CHAPTER Ⅳ CONCLUSIONS - 64 - REFERENCES - 65 -

    [1] E. Fred Schubert, Light-Emitting Diodes. Cambridge University Press, 2003
    [2] Strategies unlimited, High-Brightness LED Market Review and Forecast, July 2005
    [3] Kelly, M.K.; Ambacher, O.; Dahlheimer, B.; Groos, G.; Dimitrov, R.; Angerer, H.; Stutzman, M., “Optical patterning of GaN films,” Applied Physics Letters, v 69, n 12, Sep 16, 1996, p 1749
    [4] Kelly, M.K.; Ambacher, O.; Dimitrov, R.; Angerer, H.; Handschuh, R.; Stutzmann, M., ”Laser-processing for patterned and free-standing nitride films.” Materials Research Society Symposium - Proceedings, v 482, Nitride Semiconductors, 1997, p 973-978
    [5] Wong, W.S.; Schloss, L.F.; Sudhir, G.S.; Linder, B.P.; Yu, K.-M.; Weber, E.R.; Sands, T.; Cheung, N.W., “Pulsed excimer laser processing of AlN/GaN thin films,” Materials Research Society Symposium - Proceedings, v 449, III-V Nitrides, 1997, p 1011-1016
    [6] Wong, W.S.; Cho, Y.; Weber, E.R.; Sands, T.; Yu, K.M.; Kruger, J.; Wengrow, A.B.; Cheung, N.W., “Structural and optical quality of GaN/metal/Si heterostructures fabricated by excimer laser lift-off,” Applied Physics Letters, v 75, n 13, 1999, p 1887-1889
    [7] Cheung, N.W.; Sands, T.D.; Wong, W.S., “Separation of Thin Films from Transparent Substrates by Selective Optical Processing,” US patent number 6071795, Jun. 6, 2000
    [8] Marlow, Gregory S.; Das, Mukunda B., “The Effects of Contact Size and Non-zero Metal Resistance on the Determination of Specific Contact Resistance.” Solid-State Electronics, v 25, n 2, Feb, 1982, p 91-94
    [9] Kim, Jong Kyu; Je, Jung Ho; Lee, Jong-Lam; Park, Yong Jo; Lee, Byung-Teak, “Microstructural investigation of Ni/Au ohmic contact on p-type GaN,” Journal of the Electrochemical Society, v 147, n 12, Dec, 2000, p 4645-4651
    [10] Kim, Jong Kyu; Lee, Jong-Lam; Lee, Jae Won; Shin, Hyun Eoi; Park, Yong Jo; Kim, Taeil, “Low resistance Pd/Au ohmic contacts to p-type GaN using surface treatment,” Applied Physics Letters, v 73, n 20, Nov 16, 1998, p 2953
    [11] Jang, Ja-Soon; Chang, In-Sik; Kim, Han-Ki; Seong, Tae-Yeon; Lee, Seonghoon; Park, Seong-Ju , ”Low-resistance Pt/Ni/Au ohmic contacts to p-type GaN,” Applied Physics Letters, v 74, n 1, Jan 4, 1999, p 70
    [12] Wong, W.S.; Sands, T.; Cheung, N.W.; Kneissl, M.; Bour, D.P.; Mei, P.; Romano, L.T.; Johnson, N.M., “Fabrication of thin-film InGaN light-emitting diode membranes by laser lift-off,” Applied Physics Letters, v 75, n 10, 1999, p 1360-1362
    [13] Wong, W.S.; Sands, T.; Cheung, N.W.; Kneissl, M.; Bour, D.P.; Mei, P.; Romano, L.T.; Johnson, N.M., “InxGa1-xN light emitting diodes on Si substrates fabricated by Pd-In metal bonding and laser lift-off,” Applied Physics Letters, v 77, n 18, Oct 30, 2000, p 2822-2824
    [14] Wang, Shui-Jinn; Uang, Kai-Ming; Chen, Shiue-Lung; Yang, Yu-Cheng; Chang, Shu-Cheng; Chen, Tron-Min; Chen, Chao-Hsuing; Liou, Bor-Wen., “Use of patterned laser liftoff process and electroplating nickel layer for the fabrication of vertical-structured GaN-based light-emitting diodes,” Applied Physics Letters, v 87, n 1, Jul 4, 2005, p 011111
    [15] Horng, R.H.; Lee, C.E.; Hsu, S.C.; Huang, S.H.; Wu, C.C.; Kung, C.Y.; Wuu, D.S., “High-power GaN light-emitting diodes with patterned copper substrates by electroplating,” Physica Status Solidi (A) Applied Research, v 201, n 12, September, 2004, p 2786-2790
    [16] Hara, Tohru; Sakata, Kohji; Kawaguchi, Akihiro; Kamijima, Satoshi., “Control of agglomeration on copper seed layer employed in the copper interconnection,” Electrochemical and Solid-State Letters, v 4, n 11, November, 2001, p C81-C84
    [17] Miskys, Claudio R.; Kelly, Michael K.; Ambacher, Oliver; Stutzmann, Martin., “Freestanding GaN-substrates and devices,” Physica Status Solidi C: Conferences, v 0, n 6 SPEC. ISS., 2003, p 1627-1650
    [18] Ambacher, O.; Brandt, M.S.; Dimitrov, R.; Metzger, T.; Stutzmann, M.; Fischer, R.A.; Miehr, A.; Bergmaier, A.; Dollinger, G., “Thermal stability and desorption of Group III nitrides prepared by metal organic chemical vapor deposition,” Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, v 14, n 6, Nov-Dec, 1996, p 3532
    [19] Chu, Chen-Fu; Lai, Fang-I; Chu, Jung-Tang; Yu, Chang-Chin; Lin, Chia-Feng; Kuo, Hao-Chung; Wang, S.C., “Study of GaN light-emitting diodes fabricated by laser lift-off technique,” Journal of Applied Physics, v 95, n 8, Apr 15, 2004, p 3916-3922
    [20] Zilan, Li; Xiaodong, Hu; Ke, Chen; Ruijuan, Nie; Xuhui, Luo; Xiaoping, Zhang; Tongjun, Yu; Bei, Zhang; Song, Chen; Zhijian, Yang; Zhizhong, Chen; Guoyi, Zhang., “Preparation of GaN-based cross-sectional TEM specimens by laser lift-off,” Micron, v 36, n 3, April, 2005, p 281-284
    [21] Wang, Ting; Guo, Xia; Liu, Bin; Niu, Nan-Hui; Guo, Wei-Ling; Shen, Guang-Di., “Transient temperature field study of GaN material in laser lift-off technique based on finite element method.” Zhongguo Jiguang/Chinese Journal of Lasers, v 32, n 9, September, 2005, p 1295-1299
    [22] Bykhovski, A., Gelmont, B., Shur, M., Khan, A., “Current-voltage characteristics of strained piezoelectric structures,” Journal of Applied Physics, v 77, n 4, Feb 15, 1995, p 1616
    [23] Hsu, S.C., Liu, C.Y., “Stress analysis of transferred thin-GaN LED by Au-Si wafer bonding,” Proceedings of SPIE - The International Society for Optical Engineering, v 5941, Fifth International Conference on Solid State Lighting, 2005, p 1-8
    [24] Kozawa, T., Kachi, T., Kano, H., Nagase, H., Koide, N., Manabe, K., “Thermal stress in GaN epitaxial layers grown on sapphire substrates,” Journal of Applied Physics, v 77, n 9, May 1, 1995, p 4389
    [25] Chichibu, S., Shikanai, A., Azuhata, T., Sota, T., Kuramata, A., Horino, K., Nakamura, S., “Effects of biaxial strain on exciton resonance energies of hexagonal GaN heteroepitaxial layers,” Applied Physics Letters, v 68, n 26, Jun 24, 1996, p 3766
    [26] Chichibu, S.; Shikanai, A.; Azuhata, T.; Sota, T.; Kuramata, A.; Horino, K.; Nakamura, S., “Effects of biaxial strain on exciton resonance energies of hexagonal GaN heteroepitaxial layers,” Applied Physics Letters, v 68, n 26, Jun 24, 1996, p 3766
    [26] Jain, S.C., Pinardi, K., Maes, H.E., Van Overstraeten, R., Willander, M., Atkinson, A., “Dislocations in GaN/sapphire: Their distribution and effect on stress and optical properties,” Materials Research Society Symposium - Proceedings, v 482, Nitride Semiconductors, 1997, p 875-880
    [27] Lovergine, N., Liaci, L., Ganiere, J.-D., Leo, G., Drigo, A.V., Romanato, F., Mancini, A.M., Vasanelli, L., “Inhomogeneous strain relaxation and defect distribution of ZnTe layers deposited on (100)GaAs by metalorganic vapor phase epitaxy.” Journal of Applied Physics, v 78, n 1, Jul 1, 1995, p 229
    [28] Nakamura, Shuji, “GaN growth using GaN buffer layer,” Japanese Journal of Applied Physics, Part 2: Letters, v 30, n 10A, Oct 1, 1991, p L1705-L1707
    [29] Kozodoy, P., Ibbetson, J.P., Marchand, H., Fini, P.T., Keller, S., Speck, J.S., DenBaars, S.P., Mishra, U.K., “Electrical characterization of GaN p-n junctions with and without threading dislocations,” Applied Physics Letters, v 73, n 7, Aug 17, 1998, p 975
    [30] Cao, X.A., Stokes, E.B., Sandvik, P.M., LeBoeuf, S.F., Kretchmer, J., Walker, D., “Diffusion and tunneling currents in GaN/InGaN multiple quantum well light-emitting diodes,” IEEE Electron Device Letters, v 23, n 9, September, 2002, p 535-537
    [31] Cao, X.A., Teetsov, J.A., Shahedipour-Sandvik, F., Arthur, S.D., “Microstructural origin of leakage current in GaN/InGaN light-emitting diodes,” Journal of Crystal Growth, v 264, n 1-3, Mar 15, 2004, p 172-177
    [32] Hsu, J.W.P., Manfra, M.J., Lang, D.V., Richter, S., Chu, S.N.G., Sergent, A.M., Kleiman, R.N., Pfeiffer, L.N., Molnar, R.J., “Inhomogeneous spatial distribution of reverse bias leakage in GaN Schottky diodes,” Applied Physics Letters, v 78, n 12, Mar 19, 2001, p 1685
    [33] Li, D.S., Chen, H., Yu, H.B., Jia, H.Q., Huang, Q., Zhou, J.M., “Dependence of leakage current on dislocations in GaN-based light-emitting diodes,” Journal of Applied Physics, v 96, n 2, Jul 15, 2004, p 1111-1114
    [34] Yang, Hyuck Soo, Han, Sang Youn, Baik, K.H., Pearton, S.J., Ren, F., “Effect of inductively coupled plasma damage on performance of GaN-InGaN multiquantum-well light-emitting diodes,” Applied Physics Letters, v 86, n 10, Mar 7, 2005, p 102104
    [35] Xi, Y., Schubert, E.F., “Junction-temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method,” Applied Physics Letters, v 85, n 12, Sep 20, 2004, p 2163-2165

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