本論文針對準分子雷射微細加工系統，進行完整的光學理論分析與實驗驗證，以了解並掌握其加工的重要原理與特性；根據所獲得的理論與實驗結果，本文建立一套“有理論依據且有效率”的半色調網點灰階光罩法，可以利用準分子雷射微細加工技術製作複雜曲面的三維微結構。
本論文首先分析與模擬準分子雷射微細加工系統的光學設計，探討光罩圖案與成像面上光強分布之間的關係，提出結合光學繞射現象與光 罩圖形設計的加工方式，即半色調網點灰階光罩法，進行複雜3D曲面的微結構加工。經由實際的加工製程與實驗量測，驗證本研究所使用的光學模擬方式與半色調網點灰階光罩法的可行性與正確性。
在光學成像理論方面，藉由部分空間同調因子的定義，結合幾何光學光束追跡理論與傅氏光學繞射理論，使可以對圖形尺寸在數個雷射光波長以上的光罩進行光學模擬，得到在成像面上的光強分布，進而去探討光罩圖形對雷射加工圖形定義能力的影響。而在半色調網點灰階光罩法方面，使用一般的石英鍍鉻二元光罩，藉由光罩圖形的設計，使雷射投射在加工材料表面上的能量分布呈現三維連續變化，可快速且精確地製作複雜曲面三維微結構，由實驗量測顯示其形貌吻合度高且表面粗糙度佳。
最後，藉由實驗結果與模擬結果的比對，驗證可以透過本研究所使用的光學模擬方法來推測半色調網點灰階光罩法的理想光罩設計參數。

This study has carefully and thoroughly examined an excimer laser micromachining system in order to understand its underlying working principle and important characteristics. Based on the investigated results, both theoretical and experimental, a new type of hole-area machining method which incorporates critical optical diffraction effects of the optical projection system is developed and established. Using this new method, 3D micro-structures with complicated profiles can be easily fabricated and the surface roughness is significantly improved.
First of all, the optical imaging theory is applied on analyzing the excimer laser micromachining system. Attention is emphasized on establishing a quantitative relationship between the mask pattern and the laser intensity projected on the surface of a work piece. The analysis demonstrates the possibility and feasibility of applying the optical diffraction phenomenon on mask pattern design to achieve 3D microstructure laser-machining. Experimentally, several conventional binary photo-masks which have different hole-area pattern designs such as hole diameter, center-to-center pitch, and hole-density are prepared and used for fabricating 3D microstructures on a polycarbonate（PC）substrate. The experiment results are compared with theoretical data. Satisfactory profile accuracy and fine surface roughness are observed.
To conclude, this work has successfully established a correct and complete modeling of excimer laser micromachining system and a new approach for obtaining 3D micromachining. It provides an effective and reasonable way for designing and preparing the photo-mask with much less restriction on the smallest feature size, and therefore reduces the mask fabrication difficulty as well as the cost. Many applications and benefits can be further explored in the future.

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