| 研究生: |
蔡文皇 Tsai, Wen-Huang |
|---|---|
| 論文名稱: |
全自動虛擬量測系統應用在TFT-LCD產業 Applying the AVM System to the TFT-LCD Industry |
| 指導教授: |
鄭芳田
Cheng, Fan-Tien 洪敏雄 Hung, Min-Hsiung |
| 學位類別: |
博士 Doctor |
| 系所名稱: |
電機資訊學院 - 製造資訊與系統研究所 Institute of Manufacturing Information and Systems |
| 論文出版年: | 2012 |
| 畢業學年度: | 100 |
| 語文別: | 英文 |
| 論文頁數: | 74 |
| 中文關鍵詞: | 全自動虛擬量測系統 、二階段虛擬量測架構 |
| 外文關鍵詞: | Automatic Virtual metrology, Dual-stage VM architecture |
| 相關次數: | 點閱:96 下載:0 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
TFT-LCD產品品質對良率是很重要關鍵因素。而製程機台所生產出來的品質影響著良率,傳統的抽檢方法無法得知每片玻璃的品質。因此當機台超過規格時,產品異常無法即時發現,這些異常貨將會造成良率極大的損失。而虛擬量測是在沒有實際量測值情況下,可以達成監控每片產品所生產出品質的好方法。當考慮到全廠導入虛擬量測時,預測模型將機台數增加而快速增加,在這樣的情況下,假如我們還使用傳統方式,使用大量的歷史資料一台一台去建模,龐大的人力及資金成本將使全廠導入虛擬量測窒礙難行。所以有一套全自動虛擬量測系統,它有自動移植及更新的功能可以解決此問題,並且複製特定機台的模到其他同型還沒建模的機台,結果全廠使用全自動虛擬量測建立預測模可以節省大量的人力及時間。在TFT-LCD工廠,所有的製程機台被分為三類,包含單階段、雙階段和混合機台,每一類被選出一台代表性的機台,將全自動虛擬量測系統應用到代表性的機台。實際實施後結果顯示,自動量測系統能夠有效的預測出代表性的機台的量測值,所以自動量測系統也能精準預測其他種類的機台,除此之外自動量測系統必須處理大量的虛擬資料,所以主記憶體型資料庫技術(Main Memory Database, MMDB)被提出應用在全自動虛擬量測系統的資料處理方面。自動量測系統採用了MMDB能夠有效降低整體系統的成本,有較佳的資料儲存、快速的資料查詢及較低的資料庫成本。 最後,全自動虛擬量測系統已經成功導入TFT-LCD工廠的五代廠和六代廠,當應用全自動虛擬量測導入全廠時,效益被評估出來。結果顯示全自動虛擬量測導入全廠會降低整體的cycle time進而讓產能增加。
Processing quality of thin film transistor-liquid crystal display (TFT-LCD) manufacturing is a key factor for production yield. The processing quality of tool will affect the production yield. The conventional sampling approach cannot receive processing quality of each product. Therefore, when the equipment is out of control, the defects can not be found in time, which will result in a great yield loss. Virtual metrology (VM) is a good resolution to the problem of conjecturing manufacturing quality of a process tool based on data sensed from the process tool without physical metrology operations. When considering fab-wide VM implementation, the number of conjecture models will increase rapidly with the growing number of tools. Under such condition, if we still take the traditional method to create models one by one with a lot of historical data, then huge cost in human resources and capital will make the fab-wide VM implementation impossible. The AVM systems can have the function of automatic fanning-out and model-refreshing to solve the above-mentioned problem and copy the conjecture model of a certain tool and apply it to other tools that have no conjecture models. As a result, AVM can be automatically deployed fab-wide without waste in tremendous man-power and time for establishing conjecture models. In TFT-LCD factory, all process tools are sorted to be three types, namely single-stage, dual-stage and mixed equipment. One of each type is chosen to demonstrate this AVM architecture for TFT-LCD manufacturing. Three experimental results are predicted well by AVM, so the AVM can also do that in the other tools. In addition, AVMS needs to handle a large volume of VM-related data, a novel AVMS architecture is proposed based on Main Memory Database (MMDB) technology. The novel AVMS architecture adopts a free commercial MMDB to significantly reduce total system cost and have better data-storage efficiency, superior data-query performance, and lower database cost. Finally, The AVM system has been successfully deployed in a fifth generation and sixth TFT-LCD factory and a benefit equation is established to evaluate the profitability of applying AVM fab-wide. The evaluation result shows that AVM fab-wide implementation is expected to gain extra production volume output due to cycle-time reduction.
[1] A. Weber, "Virtual Metrology and Your Technology Watch List: Ten Things You Should Know about This Emerging Technology," Future Fab International, issue 22, section 4, pp. 52-54, Jan. 2007.
[2] Y.-C. Chang, H.-S. Fu, Y.-L. Wang, and F.-T. Cheng, "Method and System for Virtual Metrology in Semiconductor Manufacturing," United States Patent, Pub No.: US 7,359,759, Apr. 2008.
[3] K. M. Monahan, "Enabling DFM and APC Strategies at the 32 nm Technology Node," in Proc. 2005 IEEE International Symposium on Semiconductor Manufacturing (ISSM 2005), Sept. 2005, pp. 398-401.
[4] P.-H. Chen, S. Wu, J. Lin, F. Ko, H. Lo, J. Wang, C.-H. Yu, and M.-S. Liang, "Virtual Metrology: A Solution for Wafer to Wafer Advanced Process Control," in Proc. 2005 IEEE International Symposium on Semiconductor Manufacturing (ISSM 2005), Sept. 2005, pp. 155-157.
[5] Y.-C. Su, M.-H. Hung, F.-T. Cheng, and Y.-T. Chen, "A Processing Quality Prognostics Scheme for Plasma Sputtering in TFT-LCD Manufacturing," IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 183-194, May 2006.
[6] Y.-C. Su, F.-T. Cheng, M.-H. Hung, and H.-C. Huang, "Intelligent Prognostics System Design and Implementation," IEEE Transactions on Semiconductor Manufacturing, vol. 19, no. 2, pp. 195-207, May 2006.
[7] Y.-J. Chang, Y. Kang, C.-L. Hsu, C.-T. Chang, and T. Y. Chan, "Virtual Metrology Technique for Semiconductor Manufacturing," in Proc. 2006 International Joint Conference on Neural Networks (IJCNN'06), July 2006, pp. 5289-5293.
[8] M.-H. Hung, T.-H. Lin, F.-T. Cheng, and R.-C. Lin, "A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing," IEEE/ASME Transactions on Mechatronics, vol. 12, no. 3, pp. 308-316, June 2007.
[9] A. A. Khan, J. R. Moyne, and D. M. Tilbury, "An Approach for Factory-Wide Control Utilizing Virtual Metrology," IEEE Transactions on Semiconductor Manufacturing, vol. 20, no. 4, pp. 364-375, Nov. 2007.
[10] A. A. Khan, J. R. Moyne, and D. M. Tilbury, "Virtual Metrology and Feedback Control for Semiconductor Manufacturing Process Using Recursive Partial Least Squares," Journal of Process Control, vol. 18, pp. 961-974, Apr. 2008.
[11] T.-H. Lin, M.-H. Hung, R.-C. Lin, and F.-T. Cheng, "A Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing," in Proc. 2006 IEEE International Conference on Robotics and Automation, Orlando, Florida, U.S.A., pp.1054-1059, May 2006.
[12] F.-T. Cheng, H.-C. Huang, and C.-A. Kao, "Dual-Phase Virtual Metrology Scheme," IEEE Transactions on Semiconductor Manufacturing, vol. 20, no. 4, pp. 566-571, Nov. 2007.
[13] Y.-T. Huang, H.-C. Huang, F.-T. Cheng, T.-S. Liao, and F.-C. Chang, "Automatic Virtual Metrology System Design and Implementation," in Proc. 2008 IEEE International Conference on Automation Science and Engineering, Washington, D.C., U.S.A., pp. 223-229, August 2008.
[14] F.-T. Cheng, Y.-T. Chen, Y.-C. Su, and D.-L. Zeng, "Evaluating Reliance Level of a Virtual Metrology System," IEEE Transactions on Semiconductor Manufacturing, vol. 21, no. 1, pp. 92-103, Feb. 2008.
[15] W.-M. Wu, F.-T. Cheng, T.H. Lin, D.-L. Zeng, and J.-F. Chen, "Selection Schemes of Dual Virtual-Metrology Outputs for Enhancing Prediction Accuracy," to appear in IEEE Transactions on Automation Science and Engineering.
[16] SEMI E120-1104, Specification for the Common Equipment Model (CEM), U.S.A., 2004.
[17] SEMI E125-0305, Specification for Equipment Self Description (ESD), U.S.A., 2005.
[18] SEMI E132-0305, Specification for Equipment Client Authentication and Authorization (A&A), U.S.A., 2005.
[19] SEMI E134-0305, Specification for Data Collection Management (DCM), U.S.A., 2005.
[20] T.-H. Lin, F.-T. Cheng, W.-M. Wu, Chi-An Kao, A.-J. Ye, and F.-C. Chang, "NN-based Key-variable Selection Method for Enhancing Virtual Metrology Accuracy," IEEE Transactions on Semiconductor Manufacturing, vol. 22, no. 1, pp. 204-211, Feb. 2009.
[21] 2003 International Technology roadmap for Semiconductors (ITRS), December 2003. http://public.itrs.net/
[22] Y.-C. Su, M.-H. Hung, F.-T. Cheng, and Y.-T. Chen,"A Processing Quality Prognostics Scheme for Plasma Sputting in TFT-LCD Manufacturing,"IEEE Transactions on Semiconductor Manufacturing, Vol. 19, No. 2, pp. 183-194, May 2006.
[23] Y.-C. Su, F.-T. Cheng, M.-H. Hung, and H.-C. Huang, "Intelligent Prognostics System Design and Implementation," IEEE Transactions on Semiconductor Manufacturing, Vol. 19, No. 2, pp. 195-207, May 2006.
[24] Y.-J. Chang, Y. Kang, C.-L. Hsu, C.-T. Chang, and T. Y. Chan, "Virtual Metrology Technique for Semiconductor Manufacturing," in Proc. 2006 International Joint Conference on Neural Networks (IJCNN'06), pp. 5289-5293, July 2006.
[25] J. Moyne and B. Schulze, "Yield Management Enhanced Advanced Process Control System (YMeAPC)-Part I: Description and Case Study of Feedback for Optimized Multiprocess Control," IEEE Transactions on Semiconductor Manufacturing, vol. 23, no. 2, pp. 221-235, May 2010.
[26] T.-H. Pan, B.-Q. Sheng, S.-H. Wong, and S.-S. Jang, "A Virtual Metrology System for Predicting End-of-Line Electrical Properties using a MANCOVA Model with Tools Clustering," IEEE Transactions on Industrial Informatics, vol. 7, no. 2, pp. 187-195, May 2011.
[27] L.-R. Lin, Y.-C. Chiu, W.-C. Mo, C.-A. Kao, T.-M. Liu, D.-L. Zeng, and F.-T. Cheng, "Run-to-Run Control Utilizing the AVM System in the Solar Industry," 2011 IEEE International Symposium on Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration (eMDC), pp. 1-33, Sept. 5-6, 2011.
[28] Y.-T. Huang and F.-T. Cheng, "Automatic Data Quality Evaluation for the AVM System," IEEE Transactions on Semiconductor Manufacturing, vol. 24, no. 3, pp. 445-454, Aug. 2011.
[29] F.-T. Cheng, H.-C. Huang, and C.-A. Kao, "Developing an Automatic Virtual Metrology System," IEEE Transactions on Automation Science and Engineering, Vol. 9, No. 1, pp. 181-188, Jan. 2012.
[30] M.-H. Hung, H.-C. Huang, and F.-T. Cheng, "Development of an Automatic Virtual Metrology Framework for TFT-LCD Industry," in Proc. 2010 IEEE International Conference on Automation Science and Engineering, Toronto, Ontario, Canada, pp. 879-884, August 2010.
[31] J.M. del Rosario and A.N. Choudhary, "High-Performance I/O for Massively Parallel Computers: Problems and Prospects," IEEE Computer Society, Vol. 27, No. 3, pp. 59-68, March 1994.
[32] J. No, R. Thakur, and A. Choudhary, "Integrating Parallel File I/O and Database Support for High-Performance Scientific Data Management," in Proc. 2000 ACM/IEEE conference on Supercomputing, pp. 57-59, November 2000.
[33] H. Garcia-Molina and K. Salem, "Main Memory Database Systems: An Overview," IEEE Transactions on Knowledge and Data Engineering, Vol. 4, No. 6, pp. 509-516, December 1992.
[34] C.K. Liang and L. Ku, "IMDB Used in MES for High-Volume Manufacturing," e-Manufacturing & DFM Symposium 2008, ProMOS Technologies Inc., November 2008. http://www.tsia.org.tw/Seminar/eManufacturing/2008/Program/
[35] "The TPC-H Composite Query-Per-Hour Performance Metric of PostgreSQL, MySQL and MonetDB," MonetDB/SQL Performance Benchmark 2008, Centrum Wiskunde & Informatica, September 2008. http://monetdb.cwi.nl/SQL/Benchmark/TPCH/index.html
[36] M. Vermeij, W. Quak, M. Kersten, and N. Nes, "MonetDB, a Novel Spatial Column-Store DBMS," in Proc. 2008 Free and Open Source Software for Geospatial Conference, incorporating the GISSA 2008 Conference, Cape Town, South Africa, pp. 193-199, September 2008.
[37] P. A. Boncz, M. L. Kersten, and S. Manegold, "Breaking the Memory Wall in MonetDB," Communications of the ACM, Vol. 51, Issue 12, pp. 77-85, December 2008.
[38] ISMI Manufacturing Initiative, Interface A Standards, March 2004.
[39] F.-T. Cheng, J. Y.-C. Chang, H.-C. Huang, C.-A. Kao, Y.-L. Chen, and J.-L. Peng, "Benefit Model of Virtual Metrology and Integrating AVM into MES," to appear in IEEE Transactions on Semiconductor Manufacturing.
[40] O. Rothe, "ISMI Next Generation Factory," e-Manufacturing Workshop, SEMICON West 2008, USA, July, 2008. [Online]. Available: http://www.sematech.org/meetings/archives/emanufacturing/8546/01-NGF.pdf
[41] D. Stark, "Data Usage," e-Manufacturing Workshop, SEMICON West 2008, USA, July, 2008. [Online]. Available: http://www.sematech.org/meetings/archives/emanufacturing/8546/06-%20PPM%20and%20VM%20and%20EEQA.pdf
[42] J. Moyne, "PCS Mechanisms for Fab-Wide Development and Latest Trends, New Directions in PCS: Virtual Metrology," in Proc. ISMI AEC/APC Symposium XXI - North America, 2009, Ann Arbor, Michigan USA, Sep. 2009.
[43] F.-T. Cheng, C.-A. Kao, and W.-M. Wu "Advanced Process Control System and Method Utilizing Virtual Metrology with Reliance Index," U.S. Provisional Patent Pending under application 61/369,761, August 2010.
[44] A. A. Khan, J. R. Moyne, and D. M. Tilbury, "On the Quality of Virtual Metrology Data for Use in the feedback Process Control," in Proc. AEC/APC Symposium XIX - North America, Palm Springs, CA. USA, Sep. 2007.
[45] M. P. Groover, Automation, Production Systems, and Computer-Integrated Manufacturing, 2nd edition, London: Prentice Hall, 2001.
校內:2017-06-25公開