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    1
    A Study on CMP Processed High-k Nanocomposite Gate Dielectrics of Organic Thin-film Transistors

    2
    Erosion defect measurement and modeling of the copper CMP

    3
    The study of CMP Endpoint Detection Technology for Various Dielectrics and Metals

    4
    Theoretical Analysis for the Passivation Reactions on Cu-film Influenced by Fractal Measurement，Abration and Adhesion Effects in Chemical Mechanical Polishing

    5
    Theoretical Analysis and Experiments for the Effect of Pad Pattern on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers

    6
    The Theoretical Analysis for the Effect of porous structure of pad on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers

    7
    Finite Element Analysis of Multiscale Contact Stress Problems for Chemical Mechanical Polishing Processes

    8
    Slurry Flow Calculation and Process Parameter Optimization for Chemical Mechanical Planarization

    9
    Study of Nano-scale Copper Chemical Mechanical Planarization on Damascene Process for Semiconductor Integrated Circuits
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    10
    The Scorecard Application on Cu CMP New Process Release Management and Evaluation
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