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    1
    The Effects of Epoxy Molding Compounds, Substrate Materials, and Die Quantity on the Warpage of Fan-Out Panel-Level Packaging

    2
    Optimization of Structural Design for Embedded Package Electronic Components Using Thermal Stress Simulation Analysis Combined with Taguchi Method

    3
    A Study on the Structural Design Optimization of TO-Series Packaged Electronic Components Using Thermal Stress Simulation Analysis

    4
    A Study on the Construction of a Cloud-Based Production Progress Management System and Scheduling Decision Analysis

    5
    Investigation into the Effects of Plasma Surface Treatment on Material Bonding Strength Using Taguchi Method

    6
    An Optimization Model Integrating Process Parameter Design and Quality Cost for Wave Soldering Fixture Cleaning
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