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    1

    Simulation and Experiment of an Unpowered Deployable Mechanism for CubeSat Applications

    2

    The Effects of Epoxy Molding Compounds, Substrate Materials, and Die Quantity on the Warpage of Fan-Out Panel-Level Packaging

    3

    A Study on the Structural Design Optimization of TO-Series Packaged Electronic Components Using Thermal Stress Simulation Analysis

    4

    Application to the design and development of a drag-enhancement deorbit deployment mechanism for an 8U CubeSat.
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